I511M0L0-3L-DVK
I511M0L0-3L-DVK
Description:
OHIO MHF4 DEV KIT
Hersteller:
iVativ
Matchcode:
OHIO MHF4 DEV KIT
Rutronik No.:
RFMCU2319
VPE:
1
MOQ:
3
Package:
PCB
Verpackung:
BOX
Einfügen in Projektliste
Muster
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- Frequenz min
- 2360 MHz
- Frequenz max
- 2500 MHz
- Betriebs Temperatur min.
- -40 °C
- Datenspeicher
- FLASH
- Datenspeichergröße
- 192 kB
- MCU Architektur
- 32 bit
- Versorgungsspannung max.
- -0,3 V
- RAM
- 24 kB
- GPIO
- 30 no.
- SPI
- YES
- USB
- YES
- I²C
- YES
- IEEE802.15.4
- YES
- IEEE802.15.1
- YES
- Drahtlos
- TRANSCEIVE
- Betriebs Temperatur max.
- 85 °C
- Versorgungsspannung max.
- 3.6 V
- Automotive
- NO
- Gehäuse
- PCB
- RoHS Status
- RoHS-conform
- Verpackung
- BOX
- ECCN
- EAR99
- Zolltarifnummer
- 85437090990
- Land
- India
- Lieferzeit beim Hersteller
- 14 Wochen
The OHIO Development Kit (DVK) is a platform that enables development of hostless Bluetooth Low Energy wireless connectivity. It provides multiple peripheral interfaces (SPI, UART, I2C) for easy integration with peripheral devices. The DVK includes Development tool chain, software development kit for Application development and example applications to test the following:
- Bluetooth Low Energy Wireless Functionality
- Concurrent mode
- Peripherals such as LEDs, Buttons, external memory, headers
- Module power consumption
- Wireless/Serial Firmware Upgrade